大致意思是说
X-Phone欺骗了它们，拿他们的钱不干正事，它们会起诉它们，然后因为这个它们另寻出路，大概明年一季度出产品

然后，技术超前，日本觉得难，台湾觉得难，除非有成品，制造商才可以复制，还有富土康可能有技术，但瞧不上他们

还有由于技术问题，产品集成度降低，变大了，并且副屏幕只有在windows里面可以使用

还有可能涨价

都是我用百度翻译看的，有哪不对都是百度的锅＠百度翻译

Hello, dear friends. It's already middle of the summer, and we would like to tell you about our progress and achievements, as well as failures and problems. Unfortunately, there were more problems than successes. But let's talk about things one by one.
XpPhone developers failure
Entering the ranks of PGS each of us realized that the development of the most advanced portable device in the world is an extremely difficult task even for teams with vast experience and an almost infinite resource base, not to mention us. But we did not expect that it would be so difficult to push the industry forward.
After a long search for a developer team we chose guys who had created XpPhone and XpPhone 2 - and that was a big mistake. Those people turned out to be scammers. They kept giving us false reports for several months in a row, creating the illusion of active work on our product, but the truth revealed: they tried to create their own product using our resources. Fortunately, they had lack of professionalism, and the common sense helped us suspect and investigate the case. A long court trial against the scammers is going to take place, but we didn't get upset, and full of determination we continued to search for skilled contract developers.
Made in Japan
Perfectly understanding that the development of a product of our level in Japan would be extremely expensive, we nonetheless sent our agent to the homeland of portable consoles. In addition, we have invited our community to search for a suitable ODM in Japan - this fact is well known to users who have access to the PGS VAULT section. Even Intel Corporation itself tried to help us in this task.
Despite the efforts of hundreds of people, we have come to the conclusion that in Japan there are simply no contract developers experienced in Intel microchips. Of course, there are great companies like Fujitsu, which have all the necessary resources, but the reality is that they work exclusively for the internal needs of their companies.
What about Taiwan?
While visiting and talking to dozens of ODMs with the experience in development with Intel chips in Taiwan, we gave each of them the detailed technical documentation on the device development. Within a couple of weeks, almost all of those ODMs refused to take the job, giving the verdict "possible, but too complicated, too innovative for us, we will not take a risky responsibility to realize the project within the stated deadlines." Those responses upset us a bit, but we did not give up and we decided to go again to Shenzhen, the technological cradle of China, the city with the largest number of Intel developers in the world.

Back to China
There were two months of continuous negotiations with almost a hundred of Chinese ODMs. We have visited a number of Hong Kong exhibitions, including Intel HK Fair. During that event, apart from speakers from Intel itself, we were the only Intel partner to be allowed to speak on the stage. We were almost everywhere, thoroughly checking out all companies that are somehow related to the microelectronics development. During the searches we made a number of preliminary agreements with component suppliers for PGS, including manufacturers of the world's densest batteries and IPS panels.
Almost every company that we offered our project to, eventually refused to take the job. "Too difficult" they said, "Bring us a finished device, and we will copy it," they said. But finally our efforts were rewarded. Our new partner, one of the largest mobile ODM developers in China, teamed up with a group of experienced gaming hardware developers, took up the development of our device. Since mid-June, the development has entered an active stage.
And despite the cost of development has increased substantially, and we have nothing to do but to postpone the release, we will eventually achieve our goal. We do not cancel the development, we do not simplify the device to just a simple gaming netbook. We are the only proprietors of a number of patents for the entire form factor of gaming devices with two operating systems, and we are going to prove the world that the future of the industry is in our products.
Towards the release
Unfortunately, no useful groundwork has been done by the fraudsters, creators of XpPhone, so the current development team has to use materials provided only by the staff of the PGS LAB team, having to do the job from scratch. By the end of this year we expect the testing device units to be sent to journalists, while the commercial release of the product is now scheduled for the first quarter of 2018. Unfortunately, this is not the first time we defer the release of our product, we are really sorry for that, and we will do our best to avoid such delays again.
Technical modifications
Realizing that we would have to announce the postponement of the release and continue development with new partners, we were pondering on how we could improve our device. Time is against us, and Intel Z8750 SoC is now a year and a half old since its release. At a certain point we considered Pentium N4200, with heat dissipation properties close to those of our current chip, and we even managed to negotiate with Intel on the unprecedented discount, but, alas, a detailed technical analysis showed our developers that this chip and all the accompanying components are simply impossible to fit in the device of our size. For this reason, the technical changes are minor.
There are slight changes in the display diagonals. The main display is enlarged to 6 inches, while the secondary one to 3.3 inches. The resolution of the auxiliary display is changed to 800x480 pixels, while the resolution of the main display is still 1980x1080. The auxiliary display and its functionality is available only in Windows. Unfortunately, Android can't work with it.
The system on the chip which is responsible for the Android has been changed from Mediatek Helio X20 to Mediatek MT8785. They are pretty close in performance. Due to a number of restrictions on the LTE antennas for different frequencies and standards, we decided to divide the device into 3 regional versions, Western, European and Asian. Such division is quite standard for modern smartphones.
Dimensions of the device have been slightly enlarged, and now it is 170mm x 89.5mm x 18.5mm.There is a change in the logic of the main speakers. Now one of them is available in Windows, and the second one is in Android, no matter what position the operating system switch is in.
We expect a number of other, minor technical modifications, in accordance with the specifics of the implementation of the device by forces of our Chinese partners. We will keep you informed of the changes.